The powerful TIP900 software provides sophisticated data integration, visualization and event analysis, and offers users a complete solution of real-time monitoring, detection and traceability. It also analyzes and provides optimal oven dryer profile balance.

The detailed wallboard quality maps, the historical temperature trend charts and the images can be seen locally at the operator workstation or remotely. All data is stored in the LogViewer database for complete process visibility and long term traceability.

Features

Complete turnkey industrially designed hardware & software system for wallboard production
User-friendly software with clear graphical overview on a single screenDetailed continuous board quality monitoring
Real-time detection of bubbles, blisters and clumps
Failure identification function tracked in database
Automatic live rejection of defective boards
Database LogViewer for historical and quality analysis
High resolution thermal imager for accurate infrared images
Complete hardware system configured for harsh environments
Network connectivity for remote communication
Onsite TIP900 system configuration and training of your operators
Accuracy: ±2% of measured value or ±2 ºC (4 ºF), whichever is greater
Temperature Range: 350 ºC max. (662 ºF max.)
Ambient Temperature: 0 to 50 °C (32 to 122 °F)

TIP900 System Software

Detailed continuous board quality monitoring (100% of all board images are archived)
Easy recipe setup – automated scaling
Automated board defect detection and rejection
Ethernet connectivity: process data, defect reports, dryer balance profile, etc., can be shared with HMI/SCADAM
Dynamic deck-to-deck dryer profile balance monitoring
Failure identification function tracked in database
Database LogViewer for historical analysis (for remote access viewing of any TIP900 on a company network)
Configurable reject/alarm parameters

Application Need

Wallboards have to stay within a very narrow bandwidth of moisture content during and after the production process to ensure the necessary chemical and mechanical characteristics for the final product.

The chemical reaction, the variation in the raw material and the paper being used in the process can create voids, bubbles and paper blows. To identify these defects is one of the major requirements during the production process.

The wallboard drying process demands a balanced furnace through all decks to achieve product uniformity at the lowest energy consumption possible. Blowers and fans are used to achieve the balance and an overall dryer thermal balance profile is required to meet quality and energy requirements.

How we can help you

Provide a balanced dryer profile with historic view to visualize changes in the dryer over time (for maintenance and energy adjustments)
Provide a tool to detect voids, bubbles and paper blows with the capability for automatic rejection of defective boards
Traceability reporting (recipe, date, time, short and long term) to address customer claims
Provide a turnkey solution with automatic recipe change, customized setting capability, and automatic triggering to maximize the automation throughout the process

Failure Detection

Over/under-dried boards
Paper blisters
Paper blows
Mixer voids & clumps
Belt splices
Overlapped boards
Cracks and bubbles

TIP900 Specifications

Temperature Range	350ºC max. (662ºF max.)
Ambient Temperature	0 to 50°C (32 to 122°F)
Scanning Resolution	up to 1024 points @ 40 Hz
Accuracy	± 2% of measured value or ± 2ºC (4ºF), whichever is greater
Repeatability	± 1% of measured value or ± 1ºC (2ºF), whichever is greater
Shock	IEC 60068-2-27, 3 axes, operating: 5 g at 11 ms, 15 g at 6 ms
Vibration	IEC 60068-2-6, 3 axes, 10 to 150 Hz, operating 2 g above 20 Hz